Original: The basic concept is that you can take different chips on one plane or in one package and connect them
together with high-density interconnects using embedded silicon bridges. That is a much more effective
way of connecting together multiple die than using normal package traces because they tend to have worse
density and looser pitches, so you can’t get very high bandwidth connection between two or more chips on
the package. EMIB allows you to do that, allows easy heterogeneous integration where you can be connecting
a memory chip to a logic chip next to a communication chip.

ELI5: For heterogeneous integration, imagine a pirate ship next to a cruise liner, both filled with energetic chimpanzees
that need to travel back and forth between the two. To cover this gap, the traditional solution had been to provide
a ladder and safety net and hope for the best. What Intel is saying they will place staff on both ships, strap the
chimpanzees into zipline harnesses, and send them back and forth very efficiently.